Samsung earlier this week announced that it has started mass-producing high-density ePoP memory modules for smartphones, which happens to be the industry’s first such “embedded package on package” memory module. By itself, this announcement isn’t that interesting, because most people have no idea what this tech does and why it might be useful in their future mobile devices.
But people looking forward to seeing some of Samsung’s 2015 top-shelf devices in stores, including the Galaxy S6, might have a big reason to be excited about this this new type of component.
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